FAYETTEVILLE, Ark. — Leonard W. Schaper, professor of electrical engineering at the University of Arkansas, has received the William D. Ashman Memorial Award from the International Microelectronics and Packaging Society (IMAPS). Schaper received the prestigious award for his outstanding contributions to the field of electronic packaging that have led to high performance systems designs.

The William D. Ashman Memorial Award recognizes an individual who has provided significant technical contributions to the electronics packaging industry, while participating and demonstrating support of activities to enhance the electronics packaging profession. The award includes a lifetime membership and Fellow status in the organization.

Schaper has been active in electronic packaging since 1980. He joined the UA engineering faculty in 1992 as director of the High Density Electronics Center (HiDEC), where he led a research program in advanced interconnect technologies. He stepped down from his administrative position at HiDEC earlier this year to concentrate on teaching and research.

He is a member of the board of the IMAPS Educational Foundation and has served as the organization’s technical vice president. He served on the board of directors of the International Electronics Packaging Society (IEPS) for six years and was president of the society in 1996 when it merged with the original IMAPS organization.

He is a Fellow of the Institute of Electrical and Electronics Engineers (IEEE), and received that organization’s Components, Packaging and Manufacturing Technology (CPMT) Society Outstanding Sustained Technical Contributions Awards for his "many accomplishments in the field of electronic packaging, particularly related to multichip modules." He is a member of Tau Beta Pi, an engineering honor society, Eta Kappa Nu, a national electrical and computer engineering honor society, and Omicron Delta Kappa, a national leadership honor society.

Founded in 1967, IMAPS is the largest society dedicated to the advancement of growth of the use of microelectronics and electronic packaging with more than 11,000 worldwide.