Researchers Secure Patent to Improve Efficiency in Power Electronics

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Diagram showing the patented flip-chip wirebondless SiC MOSFETs in a double-side cooled power inverter application.

FAYETTEVILLE, Ark. - The U.S. Patent and Trademark Office has issued a full patent for a flip-chip wire bondless power device that was developed through research at the University of Arkansas. The patent (#10720380) represents an invention that facilitates higher power efficiency motor drives, solar inverters, and hybrid electric aircraft as an example of its widespread utility.

Sayan Seal, power modules development engineer of Wolfspeed, a CREE company; Mike Glover, former research assistant professor of electrical engineering who passed away in 2016; and Alan Mantooth, distinguished professor of electrical engineering, are the inventors of the device.  Seal, a student at the time of the research, graduated from UA with a Ph.D. in electrical engineering, with a focus on 3D silicon carbide power module integration.

The invention relates to the development of a novel 3D module architecture for silicon carbide power devices by using a two-sided contact bare die power device as a single-connection-level power device.  The arrangement exceeds state-of-the-art wire bonded module technology, and allows for more efficient heat removal and more compact module designs.  This promotes its use in many applications that demand light weight, small volume, and high power density electronics.  Another major advantage of this invention is the scalability and cost of the proposed invention.

"This patent is the culmination of exciting research and progress in the area of silicon carbide module packaging," Mantooth said.  "It promotes advanced integration that leads to higher reliability power electronics. It's also a fitting tribute to our former colleague Mike Glover, who was an integral part of the research team and is greatly missed."

With funding provided by the National Science Foundation, this is the first patent produced in the Center for Power Optimization of Electro-Thermal Systems (POETS).

About Power Optimization for Electro-Thermal Systems Center: The center is a National Science Foundation Generation-3 Engineering Research Center. At this center, engineering faculty from the University of Arkansas, University of Illinois at Urbana-Champaign, Howard University and Stanford University collaborate with members of industry to identify and carry out research projects to improve the power density of next generation electro-thermal systems that are the most relevant to industry needs. Primary application areas of research include electrified transportation inclusive of aircraft, passenger vehicles, and heavy equipment.