The campus community is invited to a luncheon featuring Lauren Boteler, who leads the thermal and packaging research programs as part of the Advanced Power Packaging group at the U.S. Army Research Laboratory.

The luncheon is hosted by the University of Arkansas Chapter of IEEE Women in Engineering. It will begin at noon today, Aug. 24, in the Electrical Engineering lounge on the third floor of Bell Engineering Center. Pizza will be provided.

Boteler received her B.S. and Ph.D. degrees in mechanical engineering from the University of Maryland in 2006 and 2011, respectively. Her work at the Army Research Laboratory, beginning in 2005, has focused on electronics packaging and thermal management solutions for a wide range of Army applications.

Boteler designs thermal and packaging solutions including 3D chip stacking, power electronics, RF HEMT devices, top side cooling, phase change materials, additive manufacturing, MEMS, and thermoelectric modules. More recently, she has initiated a research program in Advanced Power Electronics Packaging and Thermal Management which focuses on four main challenges of power electronics packaging: transient thermal mitigation, additive manufacturing, coengineering/codesign, and high-voltage packaging. Outside of work, she is passionate about renewable technology, reading and travelling.